Granted Patent
Utility
US 6,800,218 · App. 09/935,805
Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same
Inventors:
Ying Ma, Michael Jones, Thomas H. Baum, Deepak Verma, David Bernhard
Patented Case
View Patent ↗
Granted: Oct 5, 2004
Filed: Aug 23, 2001
Inventors
Ying Ma
Michael Jones
Thomas H. Baum
Deepak Verma
David Bernhard
Assignee (at issue)
ADVANCED TECHNOLOGY & MATERIALS CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.