Granted Patent
Utility
US 6,800,323 · App. 10/641,405
Porously coated open-structure substrate and method of manufacture thereof
Inventor:
Alfred I-Tsung Pan
Patented Case
View Patent ↗
Granted: Oct 5, 2004
Filed: Aug 15, 2003
Inventor
Alfred I-Tsung Pan
Assignee (at issue)
Hewlett-Packard Development Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.