Granted Patent
Utility
US 6,800,556 · App. 10/156,014
Polishing method using ceria slurry, and method of manufacturing semiconductor device
Inventor:
Toshiyasu Beppu
Patented Case
View Patent ↗
Granted: Oct 5, 2004
Filed: May 29, 2002
Inventor
Toshiyasu Beppu
Assignee (at issue)
Renesas Technology Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.