Granted Patent
Utility
US 6,800,932 · App. 10/066,023
Package for semiconductor die containing symmetrical lead and heat sink
Inventors:
Allen K. Lam, Richard K. Williams, Alex K. Choi
Patented Case
View Patent ↗
Granted: Oct 5, 2004
Filed: Jan 30, 2002
Inventors
Allen K. Lam
Richard K. Williams
Alex K. Choi
Assignee (at issue)
ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.