Granted Patent
Utility
US 6,800,946 · App. 10/328,326
Selective underfill for flip chips and flip-chip assemblies
Inventors:
Marc Chason, Jan Danvir
Patented Case
View Patent ↗
Granted: Oct 5, 2004
Filed: Dec 23, 2002
Inventors
Marc Chason
Jan Danvir
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.