Granted Patent
Utility
US 6,801,322 · App. 10/021,756
Method and apparatus for IN SITU measuring a required feature of a layer during a polishing process
Inventor:
Karl Mautz
Patented Case
View Patent ↗
Granted: Oct 5, 2004
Filed: Dec 13, 2001
Inventor
Karl Mautz
Assignee (at issue)
Freeescale Semiconductor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.