IP Library Granted Patent US 6,801,680
Granted Patent Utility
US 6,801,680 · App. 09/808,331

Signal interconnect incorporating multiple modular units

Inventor: Philip J. Lin
Patented Case View Patent ↗
Granted: Oct 5, 2004 Filed: Mar 14, 2001
Inventor
Philip J. Lin
Assignee (at issue)
Tellabs Operations, Inc.

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Quick Facts
Patent No.
US 6,801,680
App. No.
09/808,331
Filed
2001-03-14
Granted
2004-10-05
Kind
B2