IP Library › Granted Patent US 6,802,445
Granted Patent Utility
US 6,802,445 · App. 10/279,900

Cost effective substrate fabrication for flip-chip packages

Inventors: Il Kwon Shim, Jian-Jun Li, Sheila Marie L. Alvarez
Patented Case View Patent ↗
Granted: Oct 12, 2004 Filed: Oct 24, 2002
Inventors
Il Kwon Shim
Jian-Jun Li
Sheila Marie L. Alvarez
Assignee (at issue)
ST Assembly Test Services Pte Ltd

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Quick Facts
Patent No.
US 6,802,445
App. No.
10/279,900
Filed
2002-10-24
Granted
2004-10-12
Kind
B2