Granted Patent
Utility
US 6,802,446 · App. 10/060,812
Conductive adhesive material with metallurgically-bonded conductive particles
Inventors:
Arun K. Chaudhuri, Frank Stepniak, Matthew R. Walsh
Patented Case
View Patent ↗
Granted: Oct 12, 2004
Filed: Feb 1, 2002
Inventors
Arun K. Chaudhuri
Frank Stepniak
Matthew R. Walsh
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.