Granted Patent
Utility
US 6,802,745 · App. 10/298,395
Housing for accomodating a power semiconductor module and contact element for use in the housing
Inventor:
Manfred Loddenkoetter
Patented Case
View Patent ↗
Granted: Oct 12, 2004
Filed: Nov 18, 2002
Inventor
Manfred Loddenkoetter
Assignee (at issue)
EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.