Granted Patent
Utility
US 6,802,955 · App. 10/044,514
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
Inventors:
Ismail Emesh, Periya Gopalan, Phillip M. Rayer, II, Bentley J. Palmer
Patented Case
View Patent ↗
Granted: Oct 12, 2004
Filed: Jan 11, 2002
Inventors
Ismail Emesh
Periya Gopalan
Phillip M. Rayer, II
Bentley J. Palmer
Assignee (at issue)
SpeedFam-IPEC Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.