Granted Patent
Utility
US 6,803,252 · App. 09/990,247
Single and multiple layer packaging of high-speed/high-density ICs
Inventors:
Binneg Y. Lao, William W. Chen, David A. Rowe, Inho Kim
Patented Case
View Patent ↗
Granted: Oct 12, 2004
Filed: Nov 21, 2001
Inventors
Binneg Y. Lao
William W. Chen
David A. Rowe
Inho Kim
Assignee (at issue)
Sierra Monolithics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.