Granted Patent
Utility
US 6,803,253 · App. 10/000,020
Method for laminating and mounting semiconductor chip
Inventors:
Masamoto Tago, Yoshihiro Tomita
Patented Case
View Patent ↗
Granted: Oct 12, 2004
Filed: Dec 4, 2001
Inventors
Masamoto Tago
Yoshihiro Tomita
Assignees (at issue)
NEC CORPORATION
MITSUBISHI ELECTRIC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.