Granted Patent
Utility
US 6,803,254 · App. 10/423,702
Wire bonding method for a semiconductor package
Inventors:
Young-Kuk Park, Byung Joon Han, Jae Dong Kim
Patented Case
View Patent ↗
Granted: Oct 12, 2004
Filed: Apr 25, 2003
Inventors
Young-Kuk Park
Byung Joon Han
Jae Dong Kim
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.