Granted Patent
Utility
US 6,803,294 · App. 10/413,562
Semiconductor wafer and manufacturing method of semiconductor device
Inventors:
Yasuhiko Kouno, Hideo Miura, Nobuyoshi Matsuura, Masaharu Kubo
Patented Case
View Patent ↗
Granted: Oct 12, 2004
Filed: Apr 15, 2003
Inventors
Yasuhiko Kouno
Hideo Miura
Nobuyoshi Matsuura
Masaharu Kubo
Assignee (at issue)
Renesas Technology Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.