IP Library › Granted Patent US 6,803,303
Granted Patent Utility
US 6,803,303 · App. 10/193,567

Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts

Inventors: William M. Hiatt, Warren M. Farnworth, Charles M. Watkins, Nishant Sinha
Patented Case View Patent ↗
Granted: Oct 12, 2004 Filed: Jul 11, 2002
Inventors
William M. Hiatt
Warren M. Farnworth
Charles M. Watkins
Nishant Sinha
Assignee (at issue)
Micron Technology, Inc.

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Quick Facts
Patent No.
US 6,803,303
App. No.
10/193,567
Filed
2002-07-11
Granted
2004-10-12
Kind
B1