Granted Patent
Utility
US 6,803,331 · App. 10/357,601
Process for the heat treatment of a silicon wafer, and silicon wafer produced
Inventors:
Robert A. Holzl, Christoph Seuring, Reinhold Wahlich, Wilfried von Ammon
Patented Case
View Patent ↗
Granted: Oct 12, 2004
Filed: Feb 4, 2003
Inventors
Robert A. Holzl
Christoph Seuring
Reinhold Wahlich
Wilfried von Ammon
Assignee (at issue)
SILTRONIC AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.