Granted Patent
Utility
US 6,806,544 · App. 10/288,719
Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
Inventor:
Kuo-Ching Liu
Patented Case
View Patent ↗
Granted: Oct 19, 2004
Filed: Nov 5, 2002
Inventor
Kuo-Ching Liu
Assignee (at issue)
New Wave Research
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.