IP Library › Granted Patent US 6,806,570
Granted Patent Utility
US 6,806,570 · App. 10/279,267

Thermal compliant semiconductor chip wiring structure for chip scale packaging

Inventors: Jin-Yuan Lee, Eric Lin
Patented Case View Patent ↗
Granted: Oct 19, 2004 Filed: Oct 24, 2002
Inventors
Jin-Yuan Lee
Eric Lin
Assignee (at issue)
Megica Corporation

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Quick Facts
Patent No.
US 6,806,570
App. No.
10/279,267
Filed
2002-10-24
Granted
2004-10-19
Kind
B1