Granted Patent
Utility
US 6,807,064 · App. 10/236,895
Electronic component with at least one semiconductor chip and method for producing the electronic component
Inventors:
Harry Hedler, Thorsten Meyer
Patented Case
View Patent ↗
Granted: Oct 19, 2004
Filed: Sep 6, 2002
Inventors
Harry Hedler
Thorsten Meyer
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.