Granted Patent
Utility
US 6,809,416 · App. 10/160,212
Package for integrated circuit with thermal vias and method thereof
Inventor:
Nirmal Sharma
Patented Case
View Patent ↗
Granted: Oct 26, 2004
Filed: May 28, 2002
Inventor
Nirmal Sharma
Assignee (at issue)
Intersil Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.