Granted Patent
Utility
US 6,811,892 · App. 10/226,370
Lead-based solder alloys containing copper
Inventors:
Shing Yeh, Bradley H. Carter, Frank Stepniak, Scott D. Brandenburg
Patented Case
View Patent ↗
Granted: Nov 2, 2004
Filed: Aug 22, 2002
Inventors
Shing Yeh
Bradley H. Carter
Frank Stepniak
Scott D. Brandenburg
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.