Granted Patent
Utility
US 6,812,062 · App. 10/728,799
Molded wafer scale cap
Inventor:
Kia Silverbrook
Patented Case
View Patent ↗
Granted: Nov 2, 2004
Filed: Dec 8, 2003
Inventor
Kia Silverbrook
Assignee (at issue)
Silverbrook Research Pty Ltd
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.