Granted Patent
Utility
US 6,812,549 · App. 10/273,885
Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
Inventors:
Kazushige Umetsu, Yohei Kurashima, Jun Amako
Patented Case
View Patent ↗
Granted: Nov 2, 2004
Filed: Oct 21, 2002
Inventors
Kazushige Umetsu
Yohei Kurashima
Jun Amako
Assignee (at issue)
SEIKO EPSON CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.