Granted Patent
Utility
US 6,813,828 · App. 10/041,717
Method for deconstructing an integrated circuit package using lapping
Inventors:
Joseph J. Dlugokecki, Gerardo Bagalawig Nazareno, Carmencita I. Robbins, Steven Swendrowski
Patented Case
View Patent ↗
Granted: Nov 9, 2004
Filed: Jan 7, 2002
Inventors
Joseph J. Dlugokecki
Gerardo Bagalawig Nazareno
Carmencita I. Robbins
Steven Swendrowski
Assignee (at issue)
Gel Pak L.L.C.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.