Granted Patent
Utility
US 6,815,324 · App. 09/783,384
Reliable metal bumps on top of I/O pads after removal of test probe marks
Inventors:
Ching-Cheng Huang, Chuen-Jye Lin, Ming-Ta Lei, Mou-Shiung Lin
Patented Case
View Patent ↗
Granted: Nov 9, 2004
Filed: Feb 15, 2001
Inventors
Ching-Cheng Huang
Chuen-Jye Lin
Ming-Ta Lei
Mou-Shiung Lin
Assignee (at issue)
Megica Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.