Granted Patent
Utility
US 6,815,339 · App. 10/323,883
Method for forming copper metal line in semiconductor device
Inventor:
Kyeong Keun Choi
Patented Case
View Patent ↗
Granted: Nov 9, 2004
Filed: Dec 20, 2002
Inventor
Kyeong Keun Choi
Assignee (at issue)
SK hynix Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.