Granted Patent
Utility
US 6,815,345 · App. 10/302,809
Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
Inventors:
Yan Zhao, Chang-Chun Yeh, Zhongwei Chen, Jack Jau
Patented Case
View Patent ↗
Granted: Nov 9, 2004
Filed: Nov 21, 2002
Inventors
Yan Zhao
Chang-Chun Yeh
Zhongwei Chen
Jack Jau
Assignee (at issue)
Hermes Microvision, Inc. (Taiwan)
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.