IP Library › Granted Patent US 6,817,870
Granted Patent Utility
US 6,817,870 · App. 10/459,475

Technique for interconnecting multilayer circuit boards

Inventors: Herman Kwong, Aneta Wyrzykowska, Luigi Difilippo
Patented Case View Patent ↗
Granted: Nov 16, 2004 Filed: Jun 12, 2003
Inventors
Herman Kwong
Aneta Wyrzykowska
Luigi Difilippo
Assignee (at issue)
Nortel Networks Limited

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Quick Facts
Patent No.
US 6,817,870
App. No.
10/459,475
Filed
2003-06-12
Granted
2004-11-16
Kind
B1