Granted Patent
Utility
US 6,818,545 · App. 09/798,654
Low fabrication cost, fine pitch and high reliability solder bump
Inventors:
Jin-Yuan Lee, Mou-Shiung Lin, Ching-Cheng Huang
Patented Case
View Patent ↗
Granted: Nov 16, 2004
Filed: Mar 5, 2001
Inventors
Jin-Yuan Lee
Mou-Shiung Lin
Ching-Cheng Huang
Assignee (at issue)
Megica Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.