Granted Patent
Utility
US 6,818,981 · App. 10/765,644
Heat spreader interconnect for thermally enhanced PBGA packages
Inventors:
Il Kwon Shim, Hermes T. Apale, Gerry Balanon
Patented Case
View Patent ↗
Granted: Nov 16, 2004
Filed: Jan 26, 2004
Inventors
Il Kwon Shim
Hermes T. Apale
Gerry Balanon
Assignee (at issue)
ST Assembly Test Services Pte Ltd
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.