Granted Patent
Utility
US 6,819,004 · App. 10/361,390
Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
Inventor:
Kenneth John Kirsten
Patented Case
View Patent ↗
Granted: Nov 16, 2004
Filed: Feb 10, 2003
Inventor
Kenneth John Kirsten
Assignee (at issue)
KAC Holdings, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.