Granted Patent
Utility
US 6,820,792 · App. 09/923,480
Die bonding equipment
Inventors:
Sang-Geun Kim, Seung-Chul Ahn
Patented Case
View Patent ↗
Granted: Nov 23, 2004
Filed: Aug 6, 2001
Inventors
Sang-Geun Kim
Seung-Chul Ahn
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.