Granted Patent
Utility
US 6,822,326 · App. 10/253,588
Wafer bonding hermetic encapsulation
Inventors:
Paul M. Enquist, Qin-Yi Tong, Gaius Gillman Fountain, Jr., Robert J. Markunas
Patented Case
View Patent ↗
Granted: Nov 23, 2004
Filed: Sep 25, 2002
Inventors
Paul M. Enquist
Qin-Yi Tong
Gaius Gillman Fountain, Jr.
Robert J. Markunas
Assignee (at issue)
ZIPTRONIX, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.