Granted Patent
Utility
US 6,822,337 · App. 10/261,834
Window-type ball grid array semiconductor package
Inventor:
Jin-Chuan Bai
Patented Case
View Patent ↗
Granted: Nov 23, 2004
Filed: Sep 30, 2002
Inventor
Jin-Chuan Bai
Assignee (at issue)
Ultratera Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.