IP Library › Granted Patent US 6,822,338
Granted Patent Utility
US 6,822,338 · App. 10/374,727

Wiring structure of semiconductor device

Inventors: Tsutomu Aono, Kikuo Okada
Patented Case View Patent ↗
Granted: Nov 23, 2004 Filed: Feb 27, 2003
Inventors
Tsutomu Aono
Kikuo Okada
Assignee (at issue)
SANYO ELECTRIC CO., LTD.

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Quick Facts
Patent No.
US 6,822,338
App. No.
10/374,727
Filed
2003-02-27
Granted
2004-11-23
Kind
B2