Granted Patent
Utility
US 6,824,643 · App. 10/086,729
Method and device of peeling semiconductor device using annular contact members
Inventors:
Kazuhiro Yoshimoto, Kazuo Teshirogi, Eiji Yoshida
Patented Case
View Patent ↗
Granted: Nov 30, 2004
Filed: Mar 4, 2002
Inventors
Kazuhiro Yoshimoto
Kazuo Teshirogi
Eiji Yoshida
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.