Granted Patent
Utility
US 6,825,110 · App. 10/312,729
Method for fabricating semiconductor component with an optimized thickness
Inventors:
Stefan Linder, Hans-Rudolf Zeller
Patented Case
View Patent ↗
Granted: Nov 30, 2004
Filed: Dec 30, 2002
Inventors
Stefan Linder
Hans-Rudolf Zeller
Assignee (at issue)
ABB Schweiz AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.