IP Library › Granted Patent US 6,825,556
Granted Patent Utility
US 6,825,556 · App. 10/271,003

Integrated circuit package design with non-orthogonal die cut out

Inventors: Mukul Joshi, Mohan R. Nagar, Sarathy Rajagopalan
Patented Case View Patent ↗
Granted: Nov 30, 2004 Filed: Oct 15, 2002
Inventors
Mukul Joshi
Mohan R. Nagar
Sarathy Rajagopalan
Assignee (at issue)
LSI Logic Corporation

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Quick Facts
Patent No.
US 6,825,556
App. No.
10/271,003
Filed
2002-10-15
Granted
2004-11-30
Kind
B2