IP Library › Granted Patent US 6,825,563
Granted Patent Utility
US 6,825,563 · App. 10/683,101

Slotted bonding pad

Inventors: Ramaswamy Ranganathan, Maurice Othieno, Qwai H. Low
Patented Case View Patent ↗
Granted: Nov 30, 2004 Filed: Oct 9, 2003
Inventors
Ramaswamy Ranganathan
Maurice Othieno
Qwai H. Low
Assignee (at issue)
LSI Logic Corporation

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Quick Facts
Patent No.
US 6,825,563
App. No.
10/683,101
Filed
2003-10-09
Granted
2004-11-30
Kind
B1