Granted Patent
Utility
US 6,825,569 · App. 09/258,961
BGA package having substrate with patterned solder mask defining open die attach area
Inventors:
Tongbi Jiang, Edward A. Schrock
Patented Case
View Patent ↗
Granted: Nov 30, 2004
Filed: Mar 1, 1999
Inventors
Tongbi Jiang
Edward A. Schrock
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.