Granted Patent
Utility
US 6,828,196 · App. 10/652,635
Trench filling process for preventing formation of voids in trench
Inventors:
Pei-Feng Sun, Shih-Chi Lai, Mao-Song Tseng, Yi-Fu Chung
Patented Case
View Patent ↗
Granted: Dec 7, 2004
Filed: Aug 28, 2003
Inventors
Pei-Feng Sun
Shih-Chi Lai
Mao-Song Tseng
Yi-Fu Chung
Assignee (at issue)
Mosel Vitelec, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.