Granted Patent
Utility
US 6,828,514 · App. 10/354,000
High speed circuit board and method for fabrication
Inventors:
Benson Chan, John M. Lauffer, How T. Lin, Voya R. Markovich, David L. Thomas
Patented Case
View Patent ↗
Granted: Dec 7, 2004
Filed: Jan 30, 2003
Inventors
Benson Chan
John M. Lauffer
How T. Lin
Voya R. Markovich
David L. Thomas
Assignee (at issue)
Endicott Interconnect Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.