Granted Patent
Utility
US 6,828,643 · App. 10/287,668
Bonding pads over input circuits
Inventor:
Edwin M. Fulcher
Patented Case
View Patent ↗
Granted: Dec 7, 2004
Filed: Nov 4, 2002
Inventor
Edwin M. Fulcher
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.