Granted Patent
Utility
US 6,828,663 · App. 09/801,339
Method of packaging a device with a lead frame, and an apparatus formed therefrom
Inventors:
Tong-Yu Chen, Suchet P. Chai
Patented Case
View Patent ↗
Granted: Dec 7, 2004
Filed: Mar 7, 2001
Inventors
Tong-Yu Chen
Suchet P. Chai
Assignee (at issue)
TELEDYNE TECHNOLOGIES INCORPORATED
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.