Granted Patent
Utility
US 6,830,961 · App. 09/918,739
Methods for leads under chip in conventional IC package
Inventor:
David J. Corisis
Patented Case
View Patent ↗
Granted: Dec 14, 2004
Filed: Jul 31, 2001
Inventor
David J. Corisis
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.