Granted Patent
Utility
US 6,830,990 · App. 10/214,918
Method and apparatus for dicing released MEMS wafers
Inventors:
Kenneth Honer, Aaron Parker, Daniel Parker
Patented Case
View Patent ↗
Granted: Dec 14, 2004
Filed: Aug 7, 2002
Inventors
Kenneth Honer
Aaron Parker
Daniel Parker
Assignee (at issue)
Light Connect, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.