Granted Patent
Utility
US 6,830,999 · App. 10/173,182
Method of fabricating flip chip semiconductor device utilizing polymer layer for reducing thermal expansion coefficient differential
Inventor:
Rajan D. Deshmukh
Patented Case
View Patent ↗
Granted: Dec 14, 2004
Filed: Jun 17, 2002
Inventor
Rajan D. Deshmukh
Assignee (at issue)
Agere Systems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.