Granted Patent
Utility
US 6,831,360 · App. 10/021,173
Semiconductor device having an elastic resin with a low modulus of elasticity
Inventors:
Masashi Yamaura, Hirokazu Nakajima, Nobuyoshi Maejima, Mikio Negishi, Tomio Yamada, Tomomichi Koizumi, Tsuneo Endoh
Patented Case
View Patent ↗
Granted: Dec 14, 2004
Filed: Dec 19, 2001
Inventors
Masashi Yamaura
Hirokazu Nakajima
Nobuyoshi Maejima
Mikio Negishi
Tomio Yamada
Tomomichi Koizumi
Tsuneo Endoh
Assignee (at issue)
Renesas Technology Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.