IP Library › Granted Patent US 6,833,284
Granted Patent Utility
US 6,833,284 · App. 10/466,569

Method for subdividing wafers into chips

Inventors: Claudia Göltl, Frank Kuhn
Patented Case View Patent ↗
Granted: Dec 21, 2004 Filed: Jan 20, 2004
Inventors
Claudia Göltl
Frank Kuhn
Assignee (at issue)
OSRAM Opto Semiconductors GmbH

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Quick Facts
Patent No.
US 6,833,284
App. No.
10/466,569
Filed
2004-01-20
Granted
2004-12-21
Kind
B2